Power chips are attached to exterior circuits with packaging, and their efficiency relies on the assistance of the packaging. In high-power situations, power chips are generally packaged as power modules. Chip interconnection refers to the electrical link on the upper surface of the chip, which is usually aluminum bonding wire in traditional modules. ^
Typical power component package cross-section
Today, commercial silicon carbide power components still mostly utilize the packaging technology of this wire-bonded standard silicon IGBT component. They encounter troubles such as big high-frequency parasitical parameters, insufficient heat dissipation capacity, low-temperature resistance, and inadequate insulation toughness, which restrict using silicon carbide semiconductors. The screen of superb performance. In order to solve these problems and totally make use of the substantial potential advantages of silicon carbide chips, many brand-new packaging modern technologies and remedies for silicon carbide power modules have emerged over the last few years.
Silicon carbide power component bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding materials have actually established from gold wire bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have created from gold wires to copper cords, and the driving force is expense reduction; high-power gadgets have developed from aluminum wires (strips) to Cu Clips, and the driving pressure is to boost product performance. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that makes use of a solid copper bridge soldered to solder to connect chips and pins. Compared to traditional bonding product packaging methods, Cu Clip technology has the following benefits:
1. The link in between the chip and the pins is constructed from copper sheets, which, to a particular level, replaces the basic wire bonding method between the chip and the pins. For that reason, a distinct plan resistance value, greater current circulation, and better thermal conductivity can be gotten.
2. The lead pin welding location does not need to be silver-plated, which can completely conserve the cost of silver plating and bad silver plating.
3. The product appearance is totally constant with regular items and is primarily used in web servers, portable computer systems, batteries/drives, graphics cards, motors, power supplies, and other fields.
Cu Clip has two bonding techniques.
All copper sheet bonding approach
Both the Gate pad and the Source pad are clip-based. This bonding technique is more expensive and complex, however it can achieve much better Rdson and much better thermal effects.
( copper strip)
Copper sheet plus cable bonding approach
The resource pad uses a Clip technique, and eviction utilizes a Wire technique. This bonding method is somewhat more affordable than the all-copper bonding approach, conserving wafer location (applicable to very tiny gateway areas). The process is less complex than the all-copper bonding approach and can get far better Rdson and better thermal effect.
Distributor of Copper Strip
TRUNNANOÂ is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper price per ton, please feel free to contact us and send an inquiry.
Inquiry us